Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material
Reexamination Certificate
2005-05-26
2008-03-04
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified filler material
C257S789000, C438S118000
Reexamination Certificate
active
07339281
ABSTRACT:
A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first resin film is formed so as to cover a first wiring layer. Thereafter, a first through-hole is formed, which penetrates the first resin film and exposes the first wiring layer from a bottom thereof. Next, a second resin film is formed so as to fill up the first through-hole. Moreover, a second through-hole is formed in the second resin film buried in the first through-hole, and a connection part is formed.
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Nakamura Takeshi
Usui Ryosuke
Watanabe Hiroyuki
Clark S. V.
Fish & Richardson P.C.
Sanyo Electric Co,. Ltd.
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