Circuit device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material

Reexamination Certificate

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Details

C257S789000, C438S118000

Reexamination Certificate

active

07339281

ABSTRACT:
A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first resin film is formed so as to cover a first wiring layer. Thereafter, a first through-hole is formed, which penetrates the first resin film and exposes the first wiring layer from a bottom thereof. Next, a second resin film is formed so as to fill up the first through-hole. Moreover, a second through-hole is formed in the second resin film buried in the first through-hole, and a connection part is formed.

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patent: 2006/0270112 (2006-11-01), Chao et al.
patent: 2007/0052089 (2007-03-01), Kim et al.
patent: 06-177295 (1994-06-01), None

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