Circuit device and method of manufacture thereof

Details Circuit device and method of manufacture thereof Circuit device and method of manufacture thereof

2003-12-11

2008-10-28

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S782000, C257S784000

Reexamination Certificate

active

07443043

ABSTRACT:
A circuit device10comprises a die pad11, bonding pads12, a circuit element9, affixed onto die pad11, and an insulating resin14, which seals die pad11, bonding pads12, and circuit element9, and has a configuration wherein recessed parts15are formed at parts of the side surfaces of insulating resin14, and side surface of the conductive patterns that are disposed at peripheral parts are exposed from recessed parts15. By bonding pads12, which are to become connecting electrodes to the exterior, being exposed at the side surfaces, fillets of a brazing material19are formed at the sides of the device when circuit device10is mounted.

REFERENCES:
patent: 6143981 (2000-11-01), Glenn
patent: 6281047 (2001-08-01), Wu et al.
patent: 6608366 (2003-08-01), Fogelson et al.
patent: 6630729 (2003-10-01), Huang
patent: 6836009 (2004-12-01), Koon et al.
patent: 2002/0056926 (2002-05-01), Jung et al.
patent: 2003/0164554 (2003-09-01), Fee et al.

Affiliated with

Also associated with

Rating

Circuit device and method of manufacture thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit device and method of manufacture thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device and method of manufacture thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4001893