Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2005-09-06
2005-09-06
Munson, Gene M. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S666000, C257S738000, C257S778000, C257S780000, C257S784000, C257S788000
Reexamination Certificate
active
06940183
ABSTRACT:
A compound filled in lead packaging integrated circuit product includes a substrate made of a metallic material, a metallic protection layer formed on a top face of the substrate for protection of the substrate and surface mounting of an electrical appliance, the electrical appliance securely mounted on the protection layer and a compound or encapsulation material surrounding the substrate and the electrical appliance for supporting the substrate.
REFERENCES:
patent: 5324981 (1994-06-01), Kobiki et al.
patent: 5969426 (1999-10-01), Baba et al.
patent: 6262489 (2001-07-01), Koors et al.
patent: 6548328 (2003-04-01), Sakamoto et al.
patent: 6700194 (2004-03-01), Nakajima et al.
Munson Gene M.
Troxell Law Office PLLC
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