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Molded circuit package having heat dissipating post

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Molded package and semiconductor device using molded package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Molded package for semiconductor devices with leadframe locking

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Molded packaging for semiconductor device and method of manufact

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Molded plastic package with wire protection

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Molded plastic semiconductor package including an aluminum alloy

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Molded plastic semiconductor package including heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Molding composition and method, and molded article

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Molding die set and semiconductor device fabricated using...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Mounting structure having columnar electrodes and a sealing...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Multi-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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No-flow underfill composition and method

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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No-flow underfill material

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Optical component package and packaging including an optical...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Optical semiconductor device and method of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Organic acid containing compositions and methods for use...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Outline forming method for semiconductor device and semiconducto

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Overcast semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Overhang support for a stacked semiconductor device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Overmolded semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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