Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2006-10-03
2006-10-03
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S777000, C257S783000, C257S795000, C257S787000, C257S686000
Reexamination Certificate
active
07116002
ABSTRACT:
A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such that a lateral periphery of an upper die is cantilevered over a lower die thereby forming a recess. A supporting adhesive layer containing a filler is disposed upon the substrate about the lateral periphery of the lower die and substantially filling the recess. In one preferred embodiment, the filler comprises microspheres. In another preferred embodiment, the filler comprises a dummy die, an active die, or a passive die.
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Chang Abel
Chao Te-Tsung
Lii Mirng-Ji
Lin Chung-Yi
Parekh Nitin
Slater & Matsil L.L.P.
Taiwan Semiconductor Manufacturing Company , Ltd.
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