Optical component package and packaging including an optical...

Details Optical component package and packaging including an optical... Optical component package and packaging including an optical...

2006-02-21

2006-02-21

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S098000, C257S686000, C257S723000, C257S777000

Reexamination Certificate

active

07002257

ABSTRACT:
An optical component package includes a substrate, an optical component, a plurality of spacers, a plurality of wires, and a transparent molding compound. The optical component is disposed on the substrate, and the surface of the optical component located away from the substrate is used to receive an optical signal. The spacers are disposed between the substrate and optical component. The wires electrically connect the optical component to the substrate. The transparent molding compound encapsulates the optical component. In this case, the diameter of each of the spacers is equal to the thickness of the transparent molding compound minus the thickness of the optical component minus the distance between where the optical signal enters the transparent molding compound and where the optical signal is received by the optical component. Furthermore, this invention also discloses a packaging method for the optical component package.

REFERENCES:
patent: 6417908 (2002-07-01), Nishiguchi et al.
patent: 6469376 (2002-10-01), Vaiyapuri
patent: 2003/0141582 (2003-07-01), Yang et al.
patent: 2004/0080037 (2004-04-01), Foong et al.
patent: 2004/0084760 (2004-05-01), Liu et al.

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