Overmolded semiconductor package

Details Overmolded semiconductor package Overmolded semiconductor package

1995-04-27

1996-09-17

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257666, H01L 2328

Patent

active

055571506

ABSTRACT:
A technique for providing partially and fully overmolded semiconductor packages is described which prevents delamination (detachment) of the molding compound from the substrate by allowing the molding compound to flow through holes in the substrate and forming it into rivet-like anchors on the opposite side of the substrate. Various shapes of rivet-like anchors are described. Different embodiments provide for the formation of molded standoffs and locating pins integral to the anchor structures.

REFERENCES:
patent: 5136366 (1992-08-01), Worp et al.
patent: 5255157 (1993-10-01), Hegel
patent: 5262927 (1993-11-01), Chia et al.
patent: 5355283 (1994-10-01), Marrs et al.

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