No-flow underfill composition and method

Details No-flow underfill composition and method No-flow underfill composition and method

2005-09-29

2009-11-17

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S787000, C257S795000

Reexamination Certificate

active

07619318

ABSTRACT:
In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.

REFERENCES:
patent: 4545926 (1985-10-01), Fouts et al.
patent: 5804882 (1998-09-01), Tsukagoshi et al.
patent: 6221691 (2001-04-01), Schrock
patent: 6806581 (2004-10-01), Hsieh
patent: 6844052 (2005-01-01), Jiang
patent: 6903463 (2005-06-01), Takeichi et al.
patent: 2001/0021730 (2001-09-01), Kaneyoshi
patent: 2001/0055685 (2001-12-01), Kaneyoshi

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