Optical semiconductor device and method of manufacture

Details Optical semiconductor device and method of manufacture Optical semiconductor device and method of manufacture

2005-12-06

2005-12-06

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S730000

Reexamination Certificate

active

06972497

ABSTRACT:
An optical semiconductor product includes an integrated circuit chip having an optical sensor in its front face. The chip is attached to a support plate and electrical interconnection is made therebetween. A protective ring is fastened to the front face of the chip, around and at some distance from the optical sensor. A ring of encapsulating material is deposited to surround the periphery of the chip and lie between the front face of the support plate (2) and the protective ring.

REFERENCES:
patent: 5138145 (1992-08-01), Nakamura et al.
patent: 5773323 (1998-06-01), Hur
patent: 5783815 (1998-07-01), Ikeda
patent: 5786589 (1998-07-01), Segawa et al.
patent: 6117193 (2000-09-01), Glenn
patent: 6428650 (2002-08-01), Chung
patent: 6472247 (2002-10-01), Andoh et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 0 682 374 (1995-11-01), None
patent: WO 01/91193 (2001-11-01), None
French Preliminary Search Report, FA 616385/FR 0201429, dated Oct. 29, 2002.

Affiliated with

Also associated with

Rating

Optical semiconductor device and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical semiconductor device and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical semiconductor device and method of manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3484863