Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1997-11-26
2000-03-07
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257693, 257697, 257698, H01L 2328, H01L 2348, H01L 2304
Patent
active
060344415
ABSTRACT:
The present invention relates to semiconductor devices packaged using overcasting. The overcast devices of the present invention incorporate encapsulative materials, such as ultraviolet-curing material, which are cast in open stencils at approximately ambient pressure (and potentially at approximately ambient temperature) over electronic components mechanically and electrically connected to the substrate. The overcast semiconductor devices of the present invention may incorporate new encapsulative materials, including UV-cured materials and longer shelf life materials, poorly suited for the pressures and temperatures of injection molding. The overcast devices also allow the incorporation of substrate materials which are not feasible for use with a higher pressure, higher temperature forming process. At the same time, the overcast devices of the present invention maintain the low profiles associated with overmolding rather than the larger/taller profile packages generated by shell and gel and preformed package methods.
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Clark Jhihan B.
Lucent Technologies - Inc.
Saadat Mahshid
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