Back end IC wiring with improved electro-migration resistance
Backend interconnect scheme with middle dielectric layer...
Ball grid array package for high speed devices
Ball grid array semiconductor package
Ball limiting metalization process for interconnection
Barrier against metal diffusion
Barrier and landing pad structure in an integrated circuit
Barrier enhancement at the salicide layer
Barrier film deposition over metal for reduction in metal...
Barrier film deposition over metal for reduction in metal...
Barrier for capacitor over plug structures
Barrier for copper metallization
Barrier for interconnect and method
Barrier layer
Barrier layer associated with a conductor layer in damascene...
Barrier layer cladding around copper interconnect lines
Barrier layer for copper metallization in integrated circuit...
Barrier layer integrity test
Barrier layer stack to prevent Ti diffusion
Barrier layers for conductive features