Ultra low dielectric constant integrated circuit system
Ultra thin etch stop layer for damascene process
Ultra thin, single phase, diffusion barrier for metal...
Ultra-thin tantalum nitride copper interconnect barrier
Ultralow dielectric constant material as an intralevel or...
Ultralow dielectric constant material as an intralevel or...
Ultraviolet-transparent conductive film and process for...
Unlanded vias with a low dielectric constant material as an...
Upward plug filled via hole device
Use of an alloying element to form a stable oxide layer on...
Use of boron carbide as an etch-stop and barrier layer for...
Use of dummy underlayers for improvement in removal rate consist
Use of sic for preventing copper contamination of dielectric...
Use of sic for preventing copper contamination of low-k...
Use of SiO2/Sin for preventing copper contamination of low-k...
Use of small openings in large topography features to...
Use of supercritical fluid for low effective dielectric...
Using implants to lower anneal temperatures
Utilization of die active surfaces for laterally extending...
Utilization of energy absorbing layer to improve metal flow...