Reaction barrier for a multilayer structure in an integrated cir
Reconstructable interconnect structure for electronic circuits
Reduced cracking in gap filling dielectrics
Reduced electromigration and stressed induced migration of...
Reduced electromigration interconnection line
Reduced temperature contact/via filling
Reducing resistivity in interconnect structures by forming...
Reducing resistivity in interconnect structures of...
Reducing resistivity in interconnect structures of...
Reducing the migration of grain boundaries
Reduction of macro level stresses in copper/low-K wafers
Reduction of metal corrosion in semiconductor devices
Reduction of sector connecting line capacitance using...
Redundant barrier structure for interconnect and wiring...
Refractory metal capped low resistivity metal conductor lines an
Refractory metal capped low resistivity metal conductor lines an
Refractory metal capped low resistivity metal conductor lines an
Refractory metal capped low resistivity metal conductor lines an
Refractory metal capped low resistivity metal conductor lines an
Refractory metal capped low resistivity metal conductor...