4. Semiconductor device manufacturing: process
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Barrier film integrity on porous low k dielectrics by...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier first method for single damascene trench applications

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier for copper metallization

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier for use in 3-D integration of circuits

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier for use in 3-D integration of circuits

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier formation using novel sputter deposition method with...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier free copper interconnect by multi-layer copper seed

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier in gate stack for improved gate dielectric integrity

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
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Barrier in gate stack for improved gate dielectric integrity

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
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Barrier layer and a method for suppressing diffusion...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier layer and fabrication method thereof

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
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Barrier layer buffing after Cu CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Barrier layer configurations and methods for processing...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier layer decreases nitrogen contamination of peripheral gat

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Barrier layer deposition using HDP-CVD

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier layer deposition using HDP-CVD

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier layer enhancement in metallization scheme for semiconduc

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Barrier layer fabrication methods

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
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Barrier layer fabrication methods

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers
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Barrier layer for a copper metallization layer including a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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