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Technique for attaching die to leads

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Technique for attaching die to leads

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Technique for attaching die to leads

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Technique for attaching die to leads

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Technique for compensating for a difference in deposition...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Technique for compensating for substrate shrinkage during...

Semiconductor device manufacturing: process – With measuring or testing
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Technique for controlling mechanical stress in a channel...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Technique for controlling mechanical stress in a channel...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Technique for creating different mechanical strain by...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Technique for creating different mechanical strain in...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Technique for determining semiconductor substrate thickness

Semiconductor device manufacturing: process – With measuring or testing
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Technique for electrically interconnecting signals between...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Technique for elimination of pitting on silicon substrate during

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Technique for elimination of pitting on silicon substrate...

Semiconductor device manufacturing: process – Chemical etching
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Technique for elimination of pitting on silicon substrate...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
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Technique for enhancing stress transfer into channel regions...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Technique for enhancing thermal and mechanical...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
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Technique for etching a low capacitance dielectric layer

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Technique for extending the limits of photolithography

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Technique for fabricating logic elements using multiple gate...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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