Technique for enhancing thermal and mechanical...

Details Technique for enhancing thermal and mechanical... Technique for enhancing thermal and mechanical...

2007-12-11

2007-12-11

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257SE21503

Reexamination Certificate

active

11284292

ABSTRACT:
During the formation of an underfill material provided between a carrier substrate and a semiconductor chip, a common motion of particles contained in the underfill material is initiated towards the semiconductor chip, thereby adjusting the thermal and mechanical behavior of the underfill material. For instance, by applying an external force, such as gravity, a depletion zone with respect to the filler particles may be created in the vicinity of the carrier substrate, while a high particle concentration may be obtained in the vicinity of the semiconductor chip. Hence, thermal and mechanical stress redistribution by means of the underfill material may be enhanced.

REFERENCES:
patent: 4872047 (1989-10-01), Fister et al.
patent: 5981313 (1999-11-01), Tanaka
patent: 6030854 (2000-02-01), Mashimoto et al.
patent: 6049038 (2000-04-01), Suzuki
patent: 6338981 (2002-01-01), Klocke et al.
patent: 6373142 (2002-04-01), Hoang
patent: 6929980 (2005-08-01), Chiu et al.
patent: 7087994 (2006-08-01), Lee
patent: 2002/0167077 (2002-11-01), Vincent
patent: 2006/0068521 (2006-03-01), Shi et al.
Darbha et al., “Impact of Underfill Filler Particles on Reliability of Flip-Chip Interconnects,”IEEE Transactions on Components, Packaging and Manufacturing Technology-Part A, 21:275-80, 1998.
Huang et al., “Fill Pattern and Particle Distribution of Underfill Material,”IEEE Transactions on Components and Packaging Technologies, 27:493-98, 2004.

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