Technique for determining semiconductor substrate thickness

Details Technique for determining semiconductor substrate thickness Technique for determining semiconductor substrate thickness

1997-09-30

1999-10-05

Niebling, John F.

Semiconductor device manufacturing: process

With measuring or testing

438 15, 438 16, 438 17, G01R 3126, H01L 2166

Patent

active

059637811

ABSTRACT:
The invention relates to a method of measuring the thickness of a semiconductor substrate. First, a semiconductor substrate having a thickness and a photocurrent generating structure is provided. Next, the semiconductor substrate is exposed to a light source and a current generated by the light source is measured across the photocurrent generating structure. Finally, the thickness of the semiconductor substrate is determined by the current measurement.

REFERENCES:
patent: 5138256 (1992-08-01), Murphy et al.

Affiliated with

Also associated with

Rating

Technique for determining semiconductor substrate thickness does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Technique for determining semiconductor substrate thickness, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Technique for determining semiconductor substrate thickness will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1182322