Technique for attaching die to leads

Details Technique for attaching die to leads Technique for attaching die to leads

1998-03-24

2000-05-30

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438121, H01L 2144

Patent

active

060690283

ABSTRACT:
A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extends across the semiconductor die and terminate over its respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating parallel sheets of a conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.

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patent: 5749997 (1998-05-01), Tang et al.
patent: 5807767 (1998-09-01), Stroupe

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