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HDP-CVD method for spacer formation

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent

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HDP-CVD methodology for forming PMD layer

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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HDP-CVD multistep gapfill process

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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HDP-CVD process, filling-in process utilizing HDP-CVD, and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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HDP-CVD seasoning process for high power HDP-CVD gapfil to...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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HDP/PECVD methods of fabricating stress nitride structures...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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HDPCVD process and method for improving uniformity of film...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
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He treatment to improve low-k adhesion property

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Header for electronic components board in surface mount and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Headless CMP process for oxide planarization

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Healing detrimental bonds in deposited materials

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Healing of micro-cracks in an on-chip dielectric

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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Heat assembly and method of transferring heat

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Heat conductive molded body and manufacturing method thereof...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Heat conductor, especially for a sensor, and method for...

Semiconductor device manufacturing: process – Direct application of electrical current – Utilizing pulsed current
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Heat dissipating package structure and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Heat extraction from packaged semiconductor chips, scalable...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Heat processing method and apparatus for semiconductor process

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
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Heat removal in SOI devices using a buried oxide...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Heat sink and method for its production

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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