Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2007-06-26
2007-06-26
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Reexamination Certificate
active
10711512
ABSTRACT:
A high density plasma chemical vapor deposition (HDPCVD) process is disclosed. First, a first deposition step is performed on a wafer. Then, the wafer is rotated with an angle. A second deposition step is performed for completing the deposition. By the rotation of the wafer, the thin film is formed with a desired uniformity.
REFERENCES:
patent: 6770565 (2004-08-01), Olgado et al.
Lu Chien-Hung
Su Chin-Ta
Harrison Monica D.
Jiang Chyun IP Office
Jr. Carl Whitehead
MACRONIX International Co. Ltd.
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