Heat extraction from packaged semiconductor chips, scalable...

Details Heat extraction from packaged semiconductor chips, scalable... Heat extraction from packaged semiconductor chips, scalable...

2007-07-26

2009-08-11

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S127000, C438S617000, C257SE21502

Reexamination Certificate

active

07572679

ABSTRACT:
A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103aand104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height connect one sheet (103b) and the chip surface (101a); the number of conductors is scalable with the chip size. Each conductor consists of an elongated wire loop (preferably copper) with the wire ends attached to a pad (105), preferably both ends to the same pad. The major loop diameter is approximately normal to the first surface and the loop vertex in contact with the sheet (103b). The substrate (104, preferably a second metal sheet) covers at least portions of the second package surface and is thermally conductively connected to the chip.

REFERENCES:
patent: 5476211 (1995-12-01), Khandros
patent: 5989939 (1999-11-01), Fjelstad
patent: 6107682 (2000-08-01), Fjelstad
patent: 6215670 (2001-04-01), Khandros
patent: 6268662 (2001-07-01), Test et al.
patent: 6597065 (2003-07-01), Efland
patent: 6818840 (2004-11-01), Khandros
patent: 6992375 (2006-01-01), Robbins
patent: 7032311 (2006-04-01), Razon
patent: 7192861 (2007-03-01), Ano
patent: 2008/0014678 (2008-01-01), Howard et al.
Texas Instruments Incorporated U.S. Appl. No. 11/486,711, filed Jul. 14, 2006.

Affiliated with

Also associated with

Rating

Heat extraction from packaged semiconductor chips, scalable... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat extraction from packaged semiconductor chips, scalable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat extraction from packaged semiconductor chips, scalable... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4132232