Healing detrimental bonds in deposited materials

Details Healing detrimental bonds in deposited materials Healing detrimental bonds in deposited materials

2005-06-22

2008-10-21

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C438S623000, C438S624000, C438S625000, C438S626000

Reexamination Certificate

active

07439179

ABSTRACT:
A method for healing detrimental bonds in deposited materials, for example porous, low-k dielectric materials, including oxydatively processing a deposited material, processing the deposited material with a trialkyl group III compound, and processing in the presence of an alcohol. Also included in embodiments of the invention are materials with bonds healed by embodiments of the claimed method.

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