Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2009-09-25
2010-06-29
Chu, Chris C (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S113000, C438S124000, C257SE21599, C257S706000, C257S707000
Reexamination Certificate
active
07745262
ABSTRACT:
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second surface and a hollow structure, the second surface of the heat spreader being mounted on the chip, wherein the chip is larger in size than the hollow structure such that the chip is partly exposed to the hollow structure; an encapsulant formed between the heat spreader and the chip carrier, for encapsulating the chip, wherein the first surface and sides of the heat spreader are exposed from the encapsulant to dissipate heat produced from the chip; and a plurality of conductive elements disposed on the chip carrier, for electrically connecting the chip to an external device. The present invention also provides a method for fabricating the heat dissipating package structure.
REFERENCES:
patent: 4803546 (1989-02-01), Sugimoto et al.
patent: 5045922 (1991-09-01), Kodama et al.
patent: 5081067 (1992-01-01), Shimizu et al.
patent: 5523586 (1996-06-01), Sakurai
patent: 5656864 (1997-08-01), Mitsue et al.
patent: 5726079 (1998-03-01), Johnson
patent: 5883430 (1999-03-01), Johnson
patent: 5895972 (1999-04-01), Paniccia
patent: 5909057 (1999-06-01), McCormick et al.
patent: 5982621 (1999-11-01), Li
patent: 5986459 (1999-11-01), Fukaya et al.
patent: 6020221 (2000-02-01), Lim et al.
patent: 6117352 (2000-09-01), Weaver et al.
patent: 6146921 (2000-11-01), Barrow
patent: 6166914 (2000-12-01), Sugiyama et al.
patent: 6229702 (2001-05-01), Tao et al.
patent: 6232152 (2001-05-01), DiStefano et al.
patent: 6232652 (2001-05-01), Matsushima
patent: 6255140 (2001-07-01), Wang
patent: 6278182 (2001-08-01), Liu et al.
patent: 6294831 (2001-09-01), Shishido et al.
patent: 6432749 (2002-08-01), Libres
patent: 6433420 (2002-08-01), Yang et al.
patent: 6444498 (2002-09-01), Huang et al.
patent: 6458626 (2002-10-01), Huang et al.
patent: 6506626 (2003-01-01), Chiu
patent: 6507116 (2003-01-01), Caletka et al.
patent: 6541310 (2003-04-01), Lo et al.
patent: 6614102 (2003-09-01), Hoffman et al.
patent: 6654248 (2003-11-01), Fishley et al.
patent: 6699731 (2004-03-01), Huang et al.
patent: 6716676 (2004-04-01), Chen et al.
patent: 6891259 (2005-05-01), Im et al.
patent: 6921683 (2005-07-01), Nakayama
patent: 7015577 (2006-03-01), Wang
patent: 7163840 (2007-01-01), Chen et al.
patent: 2002/0195701 (2002-12-01), Bemmerl et al.
patent: 2003/0183909 (2003-10-01), Chiu
Hsiao Cheng-Hsu
Huang Chien-Ping
Chu Chris C
Siliconware Precision Industries Co. Ltd.
LandOfFree
Heat dissipating package structure and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipating package structure and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating package structure and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4213804