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Bumpless flip chip assembly with solder via

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Bumpless flip chip assembly with strips and via-fill

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Bumpless flip chip assembly with strips-in-via and plating

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Bumpless semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Bumpless wafer scale device and board assembly

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Buried biasing wells in FETs (Field Effect Transistors)

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Buried butted contact and method for fabricating

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Buried channel CMOS imager and method of forming same

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
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Buried channel in a substrate and method of making same

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Buried channel PMOS transistor in dual gate CMOS with...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Buried channel quasi-unipolar transistor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Buried channel strained silicon FET using a supply layer...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Buried channel type transistor having a trench gate and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Buried conductor for imagers

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
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Buried contact method to release plasma-included charging damage

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
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Buried contact structure in semiconductor device and method...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Buried digit line stack and process for making same

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Buried digit spacer separated capacitor array

Semiconductor device manufacturing: process – Making passive device
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Buried digit spacer-separated capacitor array

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Buried guard rings and method for forming the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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