Bumpless wafer scale device and board assembly

Details Bumpless wafer scale device and board assembly Bumpless wafer scale device and board assembly

2011-03-22

2011-03-22

Pham, Hoai v (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257SE21508

Reexamination Certificate

active

07910471

ABSTRACT:
A semiconductor chip having a planar active surface including an integrated circuit; the circuit has metallization patterns including a plurality of contact pads. Each of these contact pads has an added conductive layer on the circuit metallization. This added layer has a conformal surface adjacent the chip and a planar outer surface, and this outer surface is suitable to form metallurgical bonds without melting. The chip contact pads may have a distribution such that an area portion of the active chip surface is available for attaching a thermally conductive plate; this plate has a thickness compatible with the thickness of the conductive pad layer.

REFERENCES:
patent: 3737380 (1973-06-01), Bachmeier
patent: 4000842 (1977-01-01), Burns
patent: 5059553 (1991-10-01), Berndlmaier et al.
patent: 5249728 (1993-10-01), Lam
patent: 5367195 (1994-11-01), DiGiacomo et al.
patent: 5872404 (1999-02-01), Lynch et al.
patent: 5943597 (1999-08-01), Kleffner et al.
patent: 6177731 (2001-01-01), Ishida et al.
patent: 6348730 (2002-02-01), Yi et al.
patent: 6492197 (2002-12-01), Rinne
patent: 6501185 (2002-12-01), Chow et al.
patent: 6614113 (2003-09-01), Watanabe et al.
patent: 6617687 (2003-09-01), Akram et al.
patent: 6617696 (2003-09-01), Bendal
patent: 6709901 (2004-03-01), Yamazaki et al.
patent: 6798050 (2004-09-01), Homma et al.
patent: 2001/0033020 (2001-10-01), Stierman et al.
patent: 62144346 (1987-08-01), None

Affiliated with

Also associated with

Rating

Bumpless wafer scale device and board assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bumpless wafer scale device and board assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bumpless wafer scale device and board assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2657129