Buried conductor for imagers

Details Buried conductor for imagers Buried conductor for imagers

2007-05-01

2010-11-30

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S048000, C257S290000, C257S291000, C257S432000, C257SE27133

Reexamination Certificate

active

07842523

ABSTRACT:
A pixel cell having a photo-conversion device at a surface of a substrate and at least one contact area from which charge or a signal is output or received. A first insulating layer is located over the photo-conversion device and the at least one contact area. The pixel cell further includes at least one conductor in contact with the at least one contact area. The conductor includes a polysilicon material extending through the first insulating layer and in contact with the at least one contact area. Further, a conductive material, which includes at least one of a silicide and a refractory metal, can be over and in contact with the polysilicon material.

REFERENCES:
patent: 5057448 (1991-10-01), Kuroda
patent: 5070038 (1991-12-01), Jin
patent: 5136355 (1992-08-01), Kerr et al.
patent: 5528081 (1996-06-01), Hall
patent: 6495434 (2002-12-01), Rhodes
patent: 6642087 (2003-11-01), Nozaki et al.
patent: 6867438 (2005-03-01), Maruyama et al.
patent: 2004/0169127 (2004-09-01), Ohkawa
patent: 2005/0067640 (2005-03-01), Ohkawa
patent: 2005/0199922 (2005-09-01), Park
patent: 2005/0274995 (2005-12-01), Park
patent: 0 908 956 (1999-04-01), None
Chinese Office Action with English Language Translation dated Sep. 18, 2009.

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