High performance amine based no-flow underfill materials for...

High power MCM package with improved planarity and heat...

Highly integrated chip-on-chip packaging

Hybrid chip and method therefor

Hybrid S.C. devices and method of manufacture thereof

IC card indicating state of usage and system therefor

Imprinted integrated circuit substrate and method for...

Increased stand-off height integrated circuit assemblies,...

Increased stand-off height integrated circuit assemblies,...

Induction-based heating for chip attach

Injection molded soldering process and arrangement for...

Integrated assembly-underfill flip chip process

Integrated ball grid array-pin grid array-flex circuit...

Integrated circuit and method of producing a carrier wafer...

Integrated circuit chip, electronic device and method of...

Integrated circuit die having an interference shield

Integrated circuit die with logically equivalent bonding pads

Integrated circuit micro-module

Integrated circuit package and apparatus and method of...

Integrated circuit package for flip chip and method of...