Integrated circuit die having an interference shield

Details Integrated circuit die having an interference shield Integrated circuit die having an interference shield

2006-12-19

2006-12-19

Jackson, Jerome (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S659000, C257S700000, C257S758000, C257SE23128, C257SE23114

Reexamination Certificate

active

07151011

ABSTRACT:
A package for housing a device (e.g., an integrated circuit chip or die) includes a Faraday cage. The Faraday cage is at least partially formed in the integrated circuit die. The die includes conductive vias and solder balls surrounding a circuit. The package can be a ball grid array (BGA) package or flip chip package. The package substrate can include a ground plane.

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patent: 6229404 (2001-05-01), Hatanaka
patent: WO 97 35344 (1997-09-01), None

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