Recessed encapsulated microelectronic devices and methods...

Redistributed bond pads in stacked integrated circuit die...

Redistribution layer of wafer and the fabricating method...

Reducing stress in a flip chip assembly

Register setting method and semiconductor device

Relaxed tolerance flip chip assembly

Repairable flip chip semiconductor device with excellent...

Repairable semiconductor device and method

Resin composition for encapsulating semiconductor device

Resistance-reducing conductive adhesives for attachment of...

Rework process for removing residual UV adhesive from C4...

Reworkable thermoplastic hyper-branched encapsulant

Robust manufacturing method for making a III-V compound...

Rotary chip attach process