Large area printing method for integrating device and...

Large bumps for optical flip chips

Laser diode packaging

Laser lift-off of sapphire from a nitride flip-chip

Layer transfer process and functionally enhanced integrated...

Layered chip package and method of manufacturing same

Layered chip package and method of manufacturing same

Layered chip package with wiring on the side surfaces

Lead frame and method of producing the same, and...

Lead frame routed chip pads for semiconductor packages

Leaded stacked packages having elevated die paddle

Leadframe of a leadless flip-chip package and method for...

Leadframe with a chip pad for two-sided stacking and method...

Liquid epoxy resin composition and semiconductor device

Low cost and compliant microelectronic packages for high I/O...

Low cost method of testing a cavity-up BGA substrate

Low profile chip scale stacking system and method

Low profile integrated circuit packages

Low profile stacked multi-chip package and method of forming...

Low stress method and apparatus for underfilling flip-chip...