Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-03-06
2007-03-06
Le, Thao X. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S123000, C438S124000, C257S734000, C257S778000, C257SE21511, C257SE23065, C349S150000
Reexamination Certificate
active
11099390
ABSTRACT:
First and second electrodes and first and second electrical connection portions are overlapped and electrically connected. A first substrate includes: an attachment portion, a connection portion and an extension portion, the attachment portion being attached to the second substrate, the connection portion being connected to the attachment portion and positioned outside the second substrate, and the extension portion being extending from the connection portion along an edge of the second substrate without overlapping the second substrate. The first electrical connection sections are formed on the extension portion of the first substrate.
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Hogan & Hartson LLP
Le Thao X.
Seiko Epson Corporation
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