Hybrid chip and method therefor

Details Hybrid chip and method therefor Hybrid chip and method therefor

1996-12-12

1999-01-12

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438108, H01L 2144

Patent

active

058588140

ABSTRACT:
A hybrid chip having at least two different types of semiconductor devices co-located on a common substrate, and a method therefor, are disclosed. The devices have different multiple epitaxial layer structures so that each different type of device is first grown on a separate appropriately-selected substrate, and then attached to the common substrate. According to the method, a first device is attached to the common substrate using flip-chip bonding methods. Flip-chip bonding involves attaching the device and the substrate at bonding pads, flowing a flowable hardener between the first device and the common substrate and allowing it to harden, and then removing the substrate upon which the first device was grown. The hardener is removed before attaching the second type of device via flip-chip bonding.

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patent: 5071792 (1991-12-01), VanVonno et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5385632 (1995-01-01), Goossen
Goossen et al., Demonstration of Dense Optoelectronic Integration to Si CMOS for Direct Optical Interfacing of Logic Circuits to Fiber Bundles, Proc. 21st Eur. Conf. on Opt. Comm. (ECOC'95 Brussels) pp. 181-188.

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