HDI module with integral conductive electromagnetic shield
Heat spreader anchoring & grounding method &...
Heat spreader anchoring and grounding method and thermally...
Heat-radiating tape carrier package and method for...
High density electronic interconnection
High density flip chip BGA
High density flip chip BGA
High density modularity for IC's
High density semiconductor package and method of fabrication
High density stackable and flexible substrate-based devices...
High density three-dimensional IC interconnection
High performance amine based no-flow underfill materials for...
High power MCM package with improved planarity and heat...
Highly integrated chip-on-chip packaging
Hybrid chip and method therefor
Hybrid S.C. devices and method of manufacture thereof