Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-11-22
2005-11-22
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000
Reexamination Certificate
active
06967124
ABSTRACT:
A die-attach method and assembly using film and epoxy bonds speeds manufacturing for large die assemblies while providing improved bond characteristics. An adhesive film defining an epoxy flow mask is attached to the die or substrate, epoxy is dispensed within the epoxy flow mask area and the die is then bonded to the substrate. The film controls the flow of the epoxy, preventing spillover. Additionally, the epoxy area can be made small with respect to the die size, reducing the time required to dispense the epoxy and reducing the amount of epoxy material required.
REFERENCES:
patent: 4532419 (1985-07-01), Takeda
patent: 4905124 (1990-02-01), Banjo et al.
patent: 4974120 (1990-11-01), Kodai et al.
patent: 5247429 (1993-09-01), Iwase et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5574309 (1996-11-01), Papapietro et al.
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5742479 (1998-04-01), Asakura
patent: 5784259 (1998-07-01), Asakura
patent: 5798014 (1998-08-01), Weber
patent: 5822190 (1998-10-01), Iwasaki
patent: 5835355 (1998-11-01), Dordi
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5952611 (1999-09-01), Eng et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6034427 (2000-03-01), Lan et al.
patent: 6040622 (2000-03-01), Wallace
patent: 6060778 (2000-05-01), Jeong et al.
patent: 6072243 (2000-06-01), Nakanishi
patent: 6122171 (2000-09-01), Akram et al.
patent: 6127833 (2000-10-01), Wu et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6184463 (2001-02-01), Panchou et al.
patent: 6214641 (2001-04-01), Akram
patent: 6235554 (2001-05-01), Akram et al.
patent: D445096 (2001-07-01), Wallace
patent: D446525 (2001-08-01), Okamoto et al.
patent: 6395578 (2002-05-01), Shin et al.
patent: 05136323 (1993-01-01), None
patent: 05109975 (1993-03-01), None
patent: 07017175 (1995-01-01), None
patent: 08190615 (1996-07-01), None
patent: 10-334205 (1998-12-01), None
Huemoeller Ronald Patrick
Rusli Sukianto
Amkor Technology Inc.
Estrada Michelle
Fourson George
Weiss, Moy & Harris P.C.
LandOfFree
Imprinted integrated circuit substrate and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Imprinted integrated circuit substrate and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Imprinted integrated circuit substrate and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3467623