Increased stand-off height integrated circuit assemblies,...

Details Increased stand-off height integrated circuit assemblies,... Increased stand-off height integrated circuit assemblies,...

2008-07-01

2008-07-01

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000, C438S612000, C257S780000, C257S778000, C257S779000, C257S738000, C257SE23021, C257SE23023

Reexamination Certificate

active

07393719

ABSTRACT:
Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by aligning a die with a substrate and interposing solder between corresponding substrate and die bond pads. A lifting force is applied to the die during heating of the solder to a liquescent state, thereby increasing the stand-off height of the die above the substrate. The lifting force is maintained during cooling of the solder to a solid state, thereby forming increased stand-off height solder connections.

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patent: 6965552 (2005-11-01), Tokuda et al.
patent: 2004/0232561 (2004-11-01), Odegard

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