Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-02-02
2010-10-26
Le, Thao X (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S686000
Reexamination Certificate
active
07820483
ABSTRACT:
A method of implementing an injection molded soldering process for three-dimensional structures, particularly, such as directed to three-dimensional semiconductor chip stacking. Also provide is an arrangement for implementing the injection molded soldering (IMS) process. Pursuant to an embodiment of the invention, the joining of the semiconductor chip layers with a substrate is implemented, rather than by means of currently known wire bond stacking, through the intermediary of columns of solder material formed by the IMS process, thereby providing electrical advantages imparted by the flip chip interconnect structures. In this connection, various diversely dimensioned solder column interconnects allow for simple and dependable connections to a substrate by a plurality of superimposed layers or stacked arrays of semiconductor components, such as semiconductor chips. In accordance with a further aspect, it is possible to derive a unique design for an IMS mold structure, which contains cavities for forming the columnar fill of solder, and which also incorporates further cavities acting as cutouts for dies or the positioning of other electronic packages or modules.
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Belanger Luc
Danovitch David
Knickerbocker John U.
International Business Machines - Corporation
Lau, Esq. Richard
Le Thao X
Scully , Scott, Murphy & Presser, P.C.
Trice Kimberly
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