Induction-based heating for chip attach

Details Induction-based heating for chip attach Induction-based heating for chip attach

2006-06-20

2006-06-20

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S456000

Reexamination Certificate

active

07064004

ABSTRACT:
A method for bonding a semiconductor die to a substrate is described. The method comprises arranging a semiconductor die, an interconnect, and a substrate in a suitable configuration and using induction heating to form the bond.

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Richard Haimbaugh, Ameritherm Inc., Chapter 2, Theroy of Heating by Induction, 2001 ASM International. pp. 15.

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