Adhesive bonding with low temperature grown amorphous or...
Air gap interconnect structure and method of manufacture
Air-gap insulated interconnections
Airdome enclosure for components
Bonded products and methods of fabrication therefor
Box isolation technique for integrated circuit structures
Bulk and strained silicon on insulator using local selective oxi
Chemical conversion film of tantalum or niobium, method for...
Cleaving process to fabricate multilayered substrates using...
Conductive through via structure and process for electronic...
Control of buried oxide in SIMOX
Control of buried oxide quality in low dose SIMOX
Controlling internal thermal oxidation and eliminating deep...
Creation of a polarizable layer in the buried oxide of...
Creation of high mobility channels in thin-body SOI devices
Creation of high mobility channels in thin-body SOI devices
Damascene interconnect structures including etchback for...
Deep mesa isolation in SOI
Defect control in formation of dielectrically isolated semicondu
Defect induced buried oxide (DIBOX) for throughput SOI