Bonded products and methods of fabrication therefor

Details Bonded products and methods of fabrication therefor Bonded products and methods of fabrication therefor

2006-04-18

2006-04-18

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Total dielectric isolation

C438S455000, C438S407000, C438S409000

Reexamination Certificate

active

07029986

ABSTRACT:
This invention relates to a method of fabricating a bonded product comprising at least two components that are bonded together, the method comprising the steps of: a) bringing the components together; and b) heating the components; wherein at least one of the components comprises a nanomaterial and wherein steps (a) and (b) are performed in such a manner that the components are bonded together by heating at least part of the nanomaterial. The method allows the components to be welded together at lower temperatures than for prior art methods. The method also provides a more reliable form of bonding and improves the strength of the bond formed.

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