CoSix process to improve junction leakage

Crack stop formation for high-productivity processes

Crackstop and oxygen barrier for low-K dielectric integrated...

Creating air gap in multi-level metal interconnects using...

Creation of subresolution features via flow characteristics

Cross diffusion barrier layer in polysilicon

Cross reference to related application

Cross-fill pattern for metal fill levels, power supply...

Crystal thinning method for improved yield and reliability

Crystalline aluminum oxide layers having increased energy...

Crystallographic modification of hard mask properties

Cu capping layer deposition with improved integrated circuit...

Cu damascene interconnections using barrier/capping layer

Cu film deposition equipment of semiconductor device

CVD deposition method to improve adhesion of F-containing...

CVD film formation method

CVD METHOD FOR PRODUCING AN INTERCONNECTION FILM BY...

CVD nanoporous silica low dielectric constant films

CVD of integrated Ta and TaNx films from tantalum halide...

CVD of tantalum and tantalum nitride films from tantalum...