4. Active solid-state devices (e.g., transistors, solid-state diode
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Wiring substrate and electronic parts packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Wiring substrate and process for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Wiring substrate and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Wiring substrate and semiconductor device and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Wiring substrate for high frequency applications

Active solid-state devices (e.g. – transistors – solid-state diode – Transmission line lead
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Wiring substrate for mounting semiconductor components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Wiring substrate for mounting semiconductors, method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Wiring substrate having no through holes formed in wiring...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Wiring substrate having position information

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
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Wiring substrate using embedding resin

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Wiring substrate with a wire terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Wiring substrate with improvement in tensile strength of traces

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Wiring substrate, electronic device, electro-optical device,...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...
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Wiring substrate, manufacturing method thereof, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Wiring substrate, manufacturing method thereof,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Wiring substrate, semiconductor device and package stack...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
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Wiring substrate, semiconductor device, semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Wiring tape for semiconductor device including a buffer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Wiring technique

Active solid-state devices (e.g. – transistors – solid-state diode – Including region containing crystal damage
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Wiring through terminal via fuse

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
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