Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1996-02-16
1998-07-21
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257778, 257780, H01L 2348, H01L 2352, H01L 2940
Patent
active
057838658
ABSTRACT:
A wiring substrate has a semiconductor device mounted thereonto, the semiconductor device having ball-shaped externally connecting parts. The wiring substrate includes through holes at positions corresponding to the ball-shaped externally connecting parts and electric conductors provided inside and around the through holes. Land portions of the electric conductors, at which the electric conductors are engaged with the externally connecting parts, includes sectional tapering portions, respectively. Further, the through holes have sectional tapering portions at edge portions in proximity to the land portions, respectively. The ball-shaped externally connecting parts of the semiconductor device are engaged with the land portions provided around the through holes of the wiring substrate and having the sectional tapering portions, respectively.
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patent: 4987478 (1991-01-01), Braun et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5641945 (1997-06-01), Abe et al.
patent: 5646442 (1997-07-01), Abe et al.
patent: 5702255 (1997-12-01), Murphy et al.
Higashiguchi Yutaka
Iimura Hiroshi
Inagaki Mitsuo
Teshima Yasuhiro
Totani Makoto
Arroyo Teresa M.
Fujitsu Limited
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