Wiring substrate for mounting semiconductor components

Details Wiring substrate for mounting semiconductor components Wiring substrate for mounting semiconductor components

2007-09-18

2007-09-18

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S686000, C257S700000, C257S738000, C257S777000, C257S778000

Reexamination Certificate

active

10928915

ABSTRACT:
There is disclosed a wiring board comprising a core substrate110,a build-up layer130aformed on at least one side of main surfaces the core substrate, wherein a cavity120for accommodating a chip-type decoupling capacitor121is formed in the build-up layer130a.The capacitor121includes electrode terminals on an upper surface thereof that are directly connected to a semiconductor component, and electrode terminals on a back surface of the capacitor121is connected to a wiring conductor layer132aon a bottom surface of the cavity120.This structure enables decoupling capacitor and the semiconductor component260to be connected with low resistance and low inductance.

REFERENCES:
patent: 5034850 (1991-07-01), Hernandez et al.
patent: 5973928 (1999-10-01), Blasi et al.
patent: 1 041 631 (2000-10-01), None
patent: 2000-101012 (2000-04-01), None
patent: 2000-349225 (2000-12-01), None
patent: 2001-102512 (2001-04-01), None
patent: 2001-223298 (2001-08-01), None
patent: 2001-345234 (2001-12-01), None

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