Wiring substrate, semiconductor device, semiconductor...

Details Wiring substrate, semiconductor device, semiconductor... Wiring substrate, semiconductor device, semiconductor...

2006-10-24

2006-10-24

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000, C257SE23010

Reexamination Certificate

active

07126227

ABSTRACT:
The invention can provide an improvement in the connection reliability in mounting semiconductor chips. The invention can include solder balls that are disposed on a back surface of an interposer substrate, in a manner to avoid diagonal lines of the interposer substrate, and a semiconductor chip is mounted on a surface of the interposer substrate. The invention permits electronic devices to be made that are smaller and lighter, while improving their reliability.

REFERENCES:
patent: 4599634 (1986-07-01), Culmer et al.
patent: 6587353 (2003-07-01), Sumikawa et al.
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patent: 09-298254 (1997-11-01), None
patent: 10-256428 (1998-09-01), None
patent: 2000-133668 (2000-05-01), None
patent: 2000-243862 (2000-09-01), None
patent: 2002-289645 (2002-10-01), None
patent: 2004281470 (2004-07-01), None

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