Wiring substrate and electronic parts packaging structure

Details Wiring substrate and electronic parts packaging structure Wiring substrate and electronic parts packaging structure

2007-02-27

2007-02-27

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S733000, C257S689000, C257S737000, C257S779000, C257S780000, C257S723000, C257S678000, C257S700000

Reexamination Certificate

active

10709096

ABSTRACT:
In a wiring substrate of the present invention in which a bump of an electronic parts is bonded to a connection pad of a wiring pattern provided on an insulating film by an ultrasonic flip-chip packaging, a via hole into which a via post acting as a strut to support the connection pad upon the ultrasonic flip-chip packaging is filled is arranged in the insulating film under the connection pad.

REFERENCES:
patent: 5677575 (1997-10-01), Maeta et al.
patent: 5736791 (1998-04-01), Fujiki et al.
patent: 6041495 (2000-03-01), Yoon et al.
patent: 6326561 (2001-12-01), Watanabe et al.
patent: 6399897 (2002-06-01), Umematsu et al.
patent: 6543131 (2003-04-01), Beroz et al.
patent: 6590287 (2003-07-01), Ohuchi
patent: 6798072 (2004-09-01), Kajiwara et al.
patent: 2001/0023782 (2001-09-01), Nakamura
patent: 2003/0001286 (2003-01-01), Kajiwara et al.
patent: 2003/0127747 (2003-07-01), Kajiwara et al.
patent: 0 883 330 (1998-12-01), None
patent: 1 361 612 (2003-11-01), None
patent: 2002009444 (2002-01-01), None
patent: 2002-198461 (2002-07-01), None
“Via Rich Thin Film Wiring Scheme for Electronic Packaging”, IBM Technical Disclosure Bulletin, IBM Corp. New York, US, vol. 34, No. 12, May 1, 1992, pp. 85-86.
“Improved Joint Strength, Reliability and Cost”, IBM Technical Disclosure Bulletin, IBM Corp., New York, US, vol. 36, No. 10, Oct. 1, 1993, p. 275.

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