Wiring substrate with improvement in tensile strength of traces

Details Wiring substrate with improvement in tensile strength of traces Wiring substrate with improvement in tensile strength of traces

2006-12-18

2009-06-16

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S775000, C174S250000, C361S777000

Reexamination Certificate

active

07547974

ABSTRACT:
A wiring substrate with tensile-strength enhanced traces primarily comprises a core layer, a plurality of connecting pads, a plurality of traces, and a solder resist where the connecting pads and the traces are disposed on a top of the core layer. The solder resist is formed over the top of the core layer to cover the traces with the connecting pads partially or completely exposed. Furthermore, the traces have I-shaped cross sections to enhance the tensile strength of the traces.

REFERENCES:
patent: 5706174 (1998-01-01), Distefano et al.
patent: 6365439 (2002-04-01), Miyazaki et al.
patent: 2004/0262029 (2004-12-01), McConville et al.
patent: 2006/0231953 (2006-10-01), Murata et al.

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