Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-02-23
2011-10-11
Im, Junghwa M (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S700000, C257S698000, C257S786000, C257S784000, C257SE23010
Reexamination Certificate
active
08035234
ABSTRACT:
There is provided a wiring substrate for connecting a mounting board on one surface thereof and mounting an integrated circuit chip on the opposite surface to the surface. The wiring substrate has a conductive connecting portion penetrating the substrate for connecting to at least a portion of a wiring layer of the integrated circuit chip, with the portion of a wiring layer formed on the substrate, and an insulating portion formed at a lateral side of the connecting portion for surrounding the connecting portion via a portion of the wiring substrate.
REFERENCES:
patent: 6388208 (2002-05-01), Kiani et al.
patent: 6606237 (2003-08-01), Naito et al.
patent: 6750516 (2004-06-01), Hartwell
patent: 6764931 (2004-07-01), Iijima et al.
patent: 2004/0119130 (2004-06-01), Peichl et al.
patent: 2005/0121768 (2005-06-01), Edelstein et al.
patent: 2001-102479 (2001-04-01), None
patent: 2005-086036 (2005-03-01), None
Japanese Office Action issued on Dec. 18, 2007 in connection with counterpart JP Application No. 2004-049132.
Im Junghwa M
SNR Denton US LLP
Sony Corporation
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