Wiring substrate and process for manufacturing the same

Details Wiring substrate and process for manufacturing the same Wiring substrate and process for manufacturing the same

2006-10-17

2006-10-17

Tran, Minh-Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S772000, C257S779000, C257SE23023

Reexamination Certificate

active

07122894

ABSTRACT:
A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer.

REFERENCES:
patent: 5985212 (1999-11-01), Hwang et al.
patent: 6358630 (2002-03-01), Tsukada et al.
patent: 2002/0189849 (2002-12-01), Hirose et al.
Masayoshi Date, et al., “Evaluation of Lead-Free Solder Balls Produced by Uniform Droplet Spray Method”, Hitachi Metals Technical Report, vol. 18, 2002, pp. 43-48.
Hisaaki Takao, et al., “Development of Highly Reliable Sn-Ag Lead-Free Solder Alloy”, Toyota Central R & D Labs, R & D Review, vol. 35, No. 2, 2002, pp. 39-46, Abstract.

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