Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2009-05-14
2011-10-25
Dickey, Thomas L (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23003, C257SE21505, C438S125000
Reexamination Certificate
active
08044499
ABSTRACT:
A wiring substrate is provided, including an insulating resin layer which is provided on both surfaces of a sheet-like fibrous body and with which the sheet-like fibrous body is impregnated, and a through wiring provided in a region surrounded by the insulating resin layer. The through wiring is formed using a conductive material, the conductive material is exposed on both surfaces of the insulating resin layer, the sheet-like fibrous body is positioned in the conductive material, and the sheet-like fibrous body is impregnated with the conductive material. A manufacturing method of the wiring substrate is also provided.
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Search Report (Application No. 08003899.5) Dated Apr. 6, 2009.
Search Report (Application No. 08004496.9) Dated Apr. 14, 2009.
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Aoki Tomoyuki
Chida Akihiro
Dickey Thomas L
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
Yushin Nikolay
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