Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-07-06
2010-10-19
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S701000, C257S737000, C257SE23007
Reexamination Certificate
active
07816782
ABSTRACT:
A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.
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Baba Kazuhiro
Funaya Takuo
Honda Hirokazu
Kata Keiichiro
Kikuchi Katsumi
NEC Corporation
NEC Electronics Corporation
Parekh Nitin
Sughrue & Mion, PLLC
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